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1 Ergebnisse
1
Study on the electrical performance of Au bump in FC cerami..:
, In:
2017 18th International Conference on Electronic Packaging Technology (ICEPT)
,
Lu, Feng
;
Hu, Peifeng
;
Ding, Yajun
... - p. 1517-1519 , 2017
Link:
https://doi.org/10.1109/ICEPT.2017.8046723
RT T1
2017 18th International Conference on Electronic Packaging Technology (ICEPT)
: T1
Study on the electrical performance of Au bump in FC ceramic package
UL https://suche.suub.uni-bremen.de/peid=ieee-8046723&Exemplar=1&LAN=DE A1 Lu, Feng A1 Hu, Peifeng A1 Ding, Yajun A1 Cao, Yusheng A1 Lian, Binhao A1 Wang, Yong YR 2017 K1 Packaging K1 Gold K1 Iron K1 Performance evaluation K1 Military standards K1 Au bump K1 FC package K1 return loss K1 insertion loss SP 1517 OP 1519 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT.2017.8046723 DO https://doi.org/10.1109/ICEPT.2017.8046723 SF ELIB - SuUB Bremen
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