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1 Ergebnisse
1
Wafer pattern classification and auto disposition by machin..:
, In:
2017 Joint International Symposium on e-Manufacturing and Design Collaboration (eMDC) & Semiconductor Manufacturing (ISSM)
,
Kung, Ji Fu
;
Cheng, Patrick
;
Hwu, Austin
.. - p. 1-3 , 2017
Link:
https://doi.org/10.23919/ISSM.2017.8089084
RT T1 <cTitle>2017 Joint International Symposium on e-Manufacturing and Design Collaboration (eMDC) & Semiconductor Manufacturing (ISSM)</cTitle>: T1 <Title>Wafer pattern classification and auto disposition by machine learning — James Lin</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-8089084&Exemplar=1&LAN=DE A1 Kung, Ji Fu A1 Cheng, Patrick A1 Hwu, Austin A1 Chuang Tse Wang A1 Hsu, Y.B. YR 2017 K1 Tools K1 Semiconductor device modeling K1 Pattern classification K1 Text mining K1 Machine learning K1 Feature extraction K1 Text Mining K1 Image Processing K1 Deep Learning K1 Google TensorFlow K1 Auto Disposition SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.23919/ISSM.2017.8089084 DO https://doi.org/10.23919/ISSM.2017.8089084 SF ELIB - SuUB Bremen
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