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A simple metal-semiconductor substructure for the advanced ..:
, In:
2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
,
Bojita, Adrian
;
Boianceanu, Cristian
;
Purcar, Marius
.. - p. 1-6 , 2017
Link:
https://doi.org/10.1109/THERMINIC.2017.8233803
RT T1
2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
: T1
A simple metal-semiconductor substructure for the advanced thermo-mechanical numerical modeling of the power integrated circuits
UL https://suche.suub.uni-bremen.de/peid=ieee-8233803&Exemplar=1&LAN=DE A1 Bojita, Adrian A1 Boianceanu, Cristian A1 Purcar, Marius A1 Florea, Ciprian A1 Plesa, Cosmin-Sorin YR 2017 SN 2474-1523 K1 Metals K1 Temperature distribution K1 Stress K1 Strain K1 Integrated circuit modeling K1 Silicon K1 Finite element analysis SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/THERMINIC.2017.8233803 DO https://doi.org/10.1109/THERMINIC.2017.8233803 SF ELIB - SuUB Bremen
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