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Pixel/DRAM/logic 3-layer stacked CMOS image sensor technolo..:

, In: 2017 IEEE International Electron Devices Meeting (IEDM),
Tsugawa, H. ; Takahashi, H. ; Nakamura, R.... - p. 3.2.1-3.2.4 , 2017
Link: https://doi.org/10.1109/IEDM.2017.8268317