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2.5D Silicon optical interposer for 400 Gbps electronic-pho..:

, In: 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC),
Kim, Do-Won ; Au, K.Y. ; Xianshu Luo, Hong Yu Li... - p. 1-4 , 2017
Link: https://doi.org/10.1109/EPTC.2017.8277464