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Silica filler content in NCP and its effects on the reliabi..:

, In: 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC),
Alves Braganca, Wagno ; Eom, Yong-Sung ; Son, Jihye... - p. 1-8 , 2017
Link: https://doi.org/10.1109/EPTC.2017.8277495