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Measuring the wafer temperature in HVM process tools using ..:
, In:
2018 29th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
,
Kim, D.Y.
;
Kim, J.I.
;
Chu, Dinh
. - p. 98-102 , 2018
Link:
https://doi.org/10.1109/ASMC.2018.8373138
RT T1 <cTitle>2018 29th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)</cTitle>: T1 <Title>Measuring the wafer temperature in HVM process tools using a new approach with automated wireless HighTemp-400 and EtchTemp-SE wafer systems</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-8373138&Exemplar=1&LAN=DE A1 Kim, D.Y. A1 Kim, J.I. A1 Chu, Dinh A1 Hong, Dong Chul YR 2018 SN 2376-6697 K1 Temperature measurement K1 Plasma temperature K1 Temperature sensors K1 Temperature distribution K1 Tools K1 Production K1 Process control K1 factory automation K1 advanced metrology K1 advanced equipment and materials processes K1 advanced process control K1 equipment reliability and productivity enhancements K1 yield enhancement/learning SP 98 OP 102 LK http://dx.doi.org/https://doi.org/10.1109/ASMC.2018.8373138 DO https://doi.org/10.1109/ASMC.2018.8373138 SF ELIB - SuUB Bremen
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