I agree that this site is using cookies. You can find further informations here.
X
Merkliste 
 1 Ergebnisse 
 
1

A New Microsystem Packaging Approach Using 3D Printing Enca..:

, In: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC),
Goubault, B. ; Aspar, G. ; Souriau, J.-C.... - p. 118-124 , 2018
Link: https://doi.org/10.1109/ECTC.2018.00026