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1 Ergebnisse
1
A 77GHz Antenna-in-Package with Low-Cost Solution for Autom..:
, In:
2018 IEEE 68th Electronic Components and Technology Conference (ECTC)
,
Ho, Cheng-Yu
;
Hsieh, Sheng-Chi
;
Jhong, Ming-Fong
.. - p. 191-196 , 2018
Link:
https://doi.org/10.1109/ECTC.2018.00037
RT T1 <cTitle>2018 IEEE 68th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>A 77GHz Antenna-in-Package with Low-Cost Solution for Automotive Radar Applications</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-8429550&Exemplar=1&LAN=DE A1 Ho, Cheng-Yu A1 Hsieh, Sheng-Chi A1 Jhong, Ming-Fong A1 Wang, Chen-Chao A1 Ting, Chun-Yen YR 2018 SN 2377-5726 K1 Automotive engineering K1 Radar K1 Radar antennas K1 Compounds K1 Dipole antennas K1 Copper K1 Antenna radiation patterns K1 77-GHz automotive radar systems K1 flip chip ball grid array (FCBGA) package K1 flip-chip chip scale (FCCSP) package K1 Fan-out wafer level chip scale package (Fan out WLP) K1 Advanced single sided substrates (aS3 package) K1 Antenna in package (AiP). Package fabrication tolerances K1 Bandwidth K1 Radiation pattern SP 191 OP 196 LK http://dx.doi.org/https://doi.org/10.1109/ECTC.2018.00037 DO https://doi.org/10.1109/ECTC.2018.00037 SF ELIB - SuUB Bremen
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