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1
Micro-Silver Sinter Paste Developed for Pressure Sintering ..:
, In:
2018 IEEE 68th Electronic Components and Technology Conference (ECTC)
,
Chew, Ly May
;
Schmitt, Wolfgang
;
Schwarzer, Christian
. - p. 323-330 , 2018
Link:
https://doi.org/10.1109/ECTC.2018.00056
RT T1 <cTitle>2018 IEEE 68th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Micro-Silver Sinter Paste Developed for Pressure Sintering on Bare Cu Surfaces under Air or Inert Atmosphere</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-8429569&Exemplar=1&LAN=DE A1 Chew, Ly May A1 Schmitt, Wolfgang A1 Schwarzer, Christian A1 Nachreiner, Jens YR 2018 SN 2377-5726 K1 Substrates K1 Silver K1 Gold K1 Metallization K1 Bonding K1 Semiconductor device measurement K1 Atmospheric measurements K1 silver sinter paste K1 Cu surface K1 delamination K1 self-diffusion K1 interdiffusion SP 323 OP 330 LK http://dx.doi.org/https://doi.org/10.1109/ECTC.2018.00056 DO https://doi.org/10.1109/ECTC.2018.00056 SF ELIB - SuUB Bremen
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