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1 Ergebnisse
1
Glass in Electronic Packaging and Integration: High Q Induc..:
, In:
2018 IEEE 68th Electronic Components and Technology Conference (ECTC)
,
Letz, Martin
;
Zihan, Wu
;
Viswanathan, Sukhadha
... - p. 1089-1096 , 2018
Link:
https://doi.org/10.1109/ECTC.2018.00167
RT T1 <cTitle>2018 IEEE 68th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Glass in Electronic Packaging and Integration: High Q Inductances for 2.35 GHz Impedance Matching in 0.05 mm Thin Glass Substrates</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-8429680&Exemplar=1&LAN=DE A1 Letz, Martin A1 Zihan, Wu A1 Viswanathan, Sukhadha A1 Jotz, Matthias A1 Maune, Holger A1 Jost, Matthias A1 Raj, P. Markondeya A1 Sundaram, Venkatesh A1 Tummala, Rao YR 2018 SN 2377-5726 K1 Inductors K1 Glass K1 Substrates K1 Solenoids K1 Radio frequency K1 Inductance K1 Q-factor K1 glass substrate K1 inductance K1 matching network K1 high Q K1 glass package K1 integrated passives SP 1089 OP 1096 LK http://dx.doi.org/https://doi.org/10.1109/ECTC.2018.00167 DO https://doi.org/10.1109/ECTC.2018.00167 SF ELIB - SuUB Bremen
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