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Co-deposition of Nano-Size SiC Particles in Micro-Via:

, In: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC),
Wu, Houya ; He, Hu ; Wang, Yan... - p. 1170-1175 , 2018
Link: https://doi.org/10.1109/ECTC.2018.00180