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1 Ergebnisse
1
An Advanced Photosensitive Dielectric Material for High-Den..:
, In:
2018 IEEE 68th Electronic Components and Technology Conference (ECTC)
,
Okamoto, Daichi
;
Shibasaki, Yoko
;
Shibata, Daisuke
... - p. 1543-1548 , 2018
Link:
https://doi.org/10.1109/ECTC.2018.00234
RT T1 <cTitle>2018 IEEE 68th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>An Advanced Photosensitive Dielectric Material for High-Density RDL with Ultra-Small Photo-Vias and Ultra-Fine Line/Space in 2.5D Interposers and Fan-Out Packages</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-8429747&Exemplar=1&LAN=DE A1 Okamoto, Daichi A1 Shibasaki, Yoko A1 Shibata, Daisuke A1 Hanada, Tadahiko A1 Liu, Fuhan A1 Sundaram, Venky A1 Tummala, Rao R YR 2018 SN 2377-5726 K1 Copper K1 Reliability K1 Insulation K1 Resistance K1 Dielectric materials K1 Resists K1 Curing K1 dielectric materials K1 ultra-small vias K1 reliability K1 high-density substrate K1 interposer K1 fan-out package SP 1543 OP 1548 LK http://dx.doi.org/https://doi.org/10.1109/ECTC.2018.00234 DO https://doi.org/10.1109/ECTC.2018.00234 SF ELIB - SuUB Bremen
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