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Reliability of Fan-Out Wafer-Level Packaging with Large Chi..:

, In: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC),

Lau, John ; Kuah, Eric ; Li, Zhang... - p. 1574-1582 , 2018

Link: https://doi.org/10.1109/ECTC.2018.00239

RT 
T1 <cTitle>2018 IEEE 68th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Reliability of Fan-Out Wafer-Level Packaging with Large Chips and Multiple Re-Distributed Layers</Title>

UL https://suche.suub.uni-bremen.de/peid=ieee-8429752&Exemplar=1&LAN=DE
				
A1 Lau, John
A1 Kuah, Eric
A1 Li, Zhang
A1 Tan, Kim Hwee
A1 Cheung, Y. M.
A1 Ng, Eric
A1 Lo, Penny
A1 Kai, Wu
A1 Hao, Ji
A1 Beica, Rozalia
A1 Wee, Koh Sau
A1 Li, Ming
A1 Ran, Jiang
A1 Xi, Cao
A1 Lim, Sze Pei
A1 Lee, N.C.
A1 Ko, Cheng-Ta
A1 Yang, Henry
A1 Chen, Y.H.
A1 Tao, Mian
A1 Lo, Jeffery
A1 Lee, Ricky
A1 Yang, Lei
A1 Li, Margie
A1 Yong, Qing Xiang
A1 Cheng, Zhong
A1 Chen, Tony
A1 Xu, Iris
A1 Fan, Nelson
YR 2018
SN 2377-5726
K1 Soldering
K1 Reliability
K1 Electronic packaging thermal management
K1 Temperature measurement
K1 Integrated circuit interconnections
K1 Electric shock
K1 Electromagnetic compatibility
K1 FOWLP
K1 Solder joints
K1 RDLs
SP 1574
OP 1582
LK http://dx.doi.org/https://doi.org/10.1109/ECTC.2018.00239
DO https://doi.org/10.1109/ECTC.2018.00239
SF ELIB - SuUB Bremen

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