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1 Ergebnisse
1
Fan-Out Wafer-Level Packaging for Heterogeneous Integration:
, In:
2018 IEEE 68th Electronic Components and Technology Conference (ECTC)
,
Lau, John
;
Li, Zhang
;
Tan, Kim Hwee
... - p. 2360-2366 , 2018
Link:
https://doi.org/10.1109/ECTC.2018.00356
RT T1 <cTitle>2018 IEEE 68th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Fan-Out Wafer-Level Packaging for Heterogeneous Integration</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-8429869&Exemplar=1&LAN=DE A1 Lau, John A1 Li, Zhang A1 Tan, Kim Hwee A1 Cheung, Y. M. A1 Ng, Eric A1 Lo, Penny A1 Kai, Wu A1 Hao, Ji A1 Wee, Koh Sau A1 Ran, Jiang A1 Xi, Cao A1 Li, Ming A1 Beica, Rozalia A1 Lim, Sze Pei A1 Lee, N.C. A1 Ko, Cheng-Ta A1 Yang, Henry A1 Chen, Y.H. A1 Tao, Mian A1 Lo, Jeffery A1 Lee, Ricky A1 Li, Margie A1 Chen, Tony A1 Xu, Iris A1 Yong, Qing Xiang A1 Cheng, Zhong A1 Fan, Nelson A1 Kuah, Eric YR 2018 SN 2377-5726 K1 Electromagnetic compatibility K1 Metals K1 Compression molding K1 Capacitors K1 Passivation K1 Glass K1 Reliability K1 FOWLP RDLs Drop Test SP 2360 OP 2366 LK http://dx.doi.org/https://doi.org/10.1109/ECTC.2018.00356 DO https://doi.org/10.1109/ECTC.2018.00356 SF ELIB - SuUB Bremen
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