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Faster Localization of Logic Soft Failures Using a Combinat..:

, In: 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA),
Goh, S.H. ; Chun, Tay Chee ; Ngow, Y.T.... - p. 1-5 , 2018
Link: https://doi.org/10.1109/IPFA.2018.8452553