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1
Compensation Method for Die Shift in Fan-Out Packaging:
, In:
2018 19th International Conference on Electronic Packaging Technology (ICEPT)
,
Sun, Yue
;
Hou, Fengze
;
Chen, Feng
... - p. 1681-1686 , 2018
Link:
https://doi.org/10.1109/ICEPT.2018.8480551
RT T1 <cTitle>2018 19th International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Compensation Method for Die Shift in Fan-Out Packaging</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-8480551&Exemplar=1&LAN=DE A1 Sun, Yue A1 Hou, Fengze A1 Chen, Feng A1 Liu, Haiyan A1 Zhang, Hengyun A1 Sun, Peng A1 Lin, Tingyu A1 Cao, Liqiang YR 2018 K1 Adhesives K1 Force K1 Electronics packaging K1 Compression molding K1 Coordinate measuring machines K1 Packaging K1 Electromagnetic compatibility K1 Fan-out wafer level packaging K1 die shift K1 compensation method SP 1681 OP 1686 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT.2018.8480551 DO https://doi.org/10.1109/ICEPT.2018.8480551 SF ELIB - SuUB Bremen
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