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1 Ergebnisse
1
The performance of sintered nanocopper interconnections for..:
, In:
2018 19th International Conference on Electronic Packaging Technology (ICEPT)
,
Liu, Qipeng
;
Zhang, G.O.
;
Zhang, Guoqi
... - p. 1476-1478 , 2018
Link:
https://doi.org/10.1109/ICEPT.2018.8480591
RT T1 <cTitle>2018 19th International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>The performance of sintered nanocopper interconnections for high temperature device</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-8480591&Exemplar=1&LAN=DE A1 Liu, Qipeng A1 Zhang, G.O. A1 Zhang, Guoqi A1 Chen, Xianping A1 Zhu, Jie A1 Zhang, Huan Kun A1 Zhang, Jiang Song A1 Zhang, Jing Guo A1 Wang, Li Gen A1 Ye, Huaiyu A1 Koh, Sau Wee YR 2018 K1 Insulated gate bipolar transistors K1 Microassembly K1 Substrates K1 Silicon K1 Temperature K1 Copper K1 Nanoscale devices K1 Nanocopper K1 die attach K1 Power device K1 paste SP 1476 OP 1478 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT.2018.8480591 DO https://doi.org/10.1109/ICEPT.2018.8480591 SF ELIB - SuUB Bremen
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