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Broadband Full-Wave BIE Impedance Characterization of 3-D I..:

, In: 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS),
Huynen, Martijn ; De Zutter, Daniel ; Vande Ginste, Dries - p. 241-243 , 2018
Link: https://doi.org/10.1109/EPEPS.2018.8534300