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1 Ergebnisse
1
Broadband Full-Wave BIE Impedance Characterization of 3-D I..:
, In:
2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
,
Huynen, Martijn
;
De Zutter, Daniel
;
Vande Ginste, Dries
- p. 241-243 , 2018
Link:
https://doi.org/10.1109/EPEPS.2018.8534300
RT T1
2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
: T1
Broadband Full-Wave BIE Impedance Characterization of 3-D Interconnects
UL https://suche.suub.uni-bremen.de/peid=ieee-8534300&Exemplar=1&LAN=DE A1 Huynen, Martijn A1 De Zutter, Daniel A1 Vande Ginste, Dries YR 2018 SN 2165-4115 K1 Surface impedance K1 Capacitance K1 Impedance K1 Admittance K1 Conductors K1 Integrated circuit interconnections K1 Integral equations K1 3-D surface admittance K1 boundary integral equation (BIE) K1 interconnect modeling SP 241 OP 243 LK http://dx.doi.org/https://doi.org/10.1109/EPEPS.2018.8534300 DO https://doi.org/10.1109/EPEPS.2018.8534300 SF ELIB - SuUB Bremen
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