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1 Ergebnisse
1
Copper Trace Thermomechanical Reliability Analysis of Ball ..:
, In:
2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
,
Shih, Sean
;
Lee, Michael YC
;
Liao, Tse-Wei
... - p. 58-61 , 2018
Link:
https://doi.org/10.1109/IMPACT.2018.8625799
RT T1 <cTitle>2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)</cTitle>: T1 <Title>Copper Trace Thermomechanical Reliability Analysis of Ball Grid Array Package</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-8625799&Exemplar=1&LAN=DE A1 Shih, Sean A1 Lee, Michael YC A1 Liao, Tse-Wei A1 Liu, D.S. A1 Shih, Meng-Kai A1 Tarng, David A1 Hung, C.P. YR 2018 SN 2150-5942 K1 Copper K1 Reliability K1 Strain K1 Substrates K1 Temperature K1 Young's modulus K1 Stress SP 58 OP 61 LK http://dx.doi.org/https://doi.org/10.1109/IMPACT.2018.8625799 DO https://doi.org/10.1109/IMPACT.2018.8625799 SF ELIB - SuUB Bremen
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