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1 Ergebnisse
1
Continuity assessment for supercritical-fluids-deposited (S..:
, In:
2019 IEEE 32nd International Conference on Microelectronic Test Structures (ICMTS)
,
Usami, Naoto
;
Ota, Etsuko
;
Higo, Akio
.. - p. 54-57 , 2019
Link:
https://doi.org/10.1109/ICMTS.2019.8730945
RT T1 <cTitle>2019 IEEE 32nd International Conference on Microelectronic Test Structures (ICMTS)</cTitle>: T1 <Title>Continuity assessment for supercritical-fluids-deposited (SCFD) Cu film as electroplating seed layer</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-8730945&Exemplar=1&LAN=DE A1 Usami, Naoto A1 Ota, Etsuko A1 Higo, Akio A1 Momose, Takeshi A1 Mita, Yoshio YR 2019 SN 2158-1029 SN 1071-9032 K1 Copper K1 Temperature measurement K1 Tin K1 Adhesives K1 Plasma temperature K1 Conductivity SP 54 OP 57 LK http://dx.doi.org/https://doi.org/10.1109/ICMTS.2019.8730945 DO https://doi.org/10.1109/ICMTS.2019.8730945 SF ELIB - SuUB Bremen
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