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1 Ergebnisse
1
Pillar-Shaped Electrodes for 3-axis Gold-Proof-Mass MEMS Ca..:
, In:
2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP)
,
Atsumi, Ken
;
Otobe, Shota
;
Koga, Tatsuya
... - p. 1-4 , 2019
Link:
https://doi.org/10.1109/DTIP.2019.8752744
RT T1 <cTitle>2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP)</cTitle>: T1 <Title>Pillar-Shaped Electrodes for 3-axis Gold-Proof-Mass MEMS Capacitive Accelerometers</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-8752744&Exemplar=1&LAN=DE A1 Atsumi, Ken A1 Otobe, Shota A1 Koga, Tatsuya A1 Ichikawa, Takashi A1 Yamane, Daisuke A1 Iida, Shinichi A1 Ito, Hiroyuki A1 Ishihara, Noboru A1 Sone, Masato A1 Machida, Katsuyuki A1 Masu, Kazuya YR 2019 K1 Electrodes K1 Capacitance K1 Micromechanical devices K1 Accelerometers K1 Sensitivity K1 Gold K1 Sensors K1 component K1 pillar-shaped electrode K1 3-axis MEMS capacitive accelerometer K1 gold proof mass K1 sensitivity SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/DTIP.2019.8752744 DO https://doi.org/10.1109/DTIP.2019.8752744 SF ELIB - SuUB Bremen
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