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1 Ergebnisse
1
Cohesive Zone Modeling and Damage Prediction of Interfacial..:
, In:
2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
,
Lall, Pradeep
;
Dornala, Kalyan
;
Suhling, Jeff
.. - p. 1030-1036 , 2019
Link:
https://doi.org/10.1109/ITHERM.2019.8757277
RT T1
2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
: T1
Cohesive Zone Modeling and Damage Prediction of Interfacial Delamination in Potted Electronics Subjected to High-G Mechanical Shock
UL https://suche.suub.uni-bremen.de/peid=ieee-8757277&Exemplar=1&LAN=DE A1 Lall, Pradeep A1 Dornala, Kalyan A1 Suhling, Jeff A1 Deep, John A1 Lowe, Ryan YR 2019 SN 2577-0799 K1 Three-dimensional displays K1 Conferences K1 Integrated circuits K1 High-G shock K1 Potted electronics K1 Cohesive Zone Modeling K1 Fine-pitch BGA SP 1030 OP 1036 LK http://dx.doi.org/https://doi.org/10.1109/ITHERM.2019.8757277 DO https://doi.org/10.1109/ITHERM.2019.8757277 SF ELIB - SuUB Bremen
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