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1 Ergebnisse
1
Convergence and Validation in ParaPower: A Design Tool for ..:
, In:
2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
,
Deckard, Michael
;
Shamberger, Patrick
;
Fish, Michael
... - p. 878-885 , 2019
Link:
https://doi.org/10.1109/ITHERM.2019.8757334
RT T1 <cTitle>2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)</cTitle>: T1 <Title>Convergence and Validation in ParaPower: A Design Tool for Phase Change Materials in Electronics Packaging</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-8757334&Exemplar=1&LAN=DE A1 Deckard, Michael A1 Shamberger, Patrick A1 Fish, Michael A1 Berman, Morris A1 Wang, Justin A1 Boteler, Lauren YR 2019 SN 2577-0799 K1 Phase change materials K1 Heating systems K1 Electronic packaging thermal management K1 Geometry K1 Tools K1 Convergence K1 Design tools K1 phase change material K1 PCM K1 thermal management K1 simulation K1 modeling SP 878 OP 885 LK http://dx.doi.org/https://doi.org/10.1109/ITHERM.2019.8757334 DO https://doi.org/10.1109/ITHERM.2019.8757334 SF ELIB - SuUB Bremen
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