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Delamination and Cracking Effects in Quad Flat Package:

, In: 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm),
Lan, Jia-Shen ; Wu, Mei-Ling - p. 847-850 , 2019
Link: https://doi.org/10.1109/ITHERM.2019.8757381