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1 Ergebnisse
1
Two-Phase Vapor Chambers with Micropillar Evaporators: A Ne..:
, In:
2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
,
Yuan, Zihao
;
Vaartstra, Geoffrey
;
Shukla, Prachi
... - p. 456-464 , 2019
Link:
https://doi.org/10.1109/ITHERM.2019.8757412
RT T1
2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
: T1
Two-Phase Vapor Chambers with Micropillar Evaporators: A New Approach to Remove Heat from Future High-Performance Chips
UL https://suche.suub.uni-bremen.de/peid=ieee-8757412&Exemplar=1&LAN=DE A1 Yuan, Zihao A1 Vaartstra, Geoffrey A1 Shukla, Prachi A1 Said, Mostafa A1 Reda, Sherief A1 Wang, Evelyn A1 Coskun, Ayse K. YR 2019 SN 2577-0799 K1 Heating systems K1 Heat transfer K1 Density measurement K1 Power system measurements K1 Coolants K1 Microchannels SP 456 OP 464 LK http://dx.doi.org/https://doi.org/10.1109/ITHERM.2019.8757412 DO https://doi.org/10.1109/ITHERM.2019.8757412 SF ELIB - SuUB Bremen
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