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Wafer-Scale Hierarchically Textured Silicon for Surface Coo..:

, In: 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm),
Sullivan, Jonathan ; Ferrer-Argemi, Laia ; Yu, Ziqi. - p. 857-862 , 2019
Link: https://doi.org/10.1109/ITHERM.2019.8757414