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Compact Liquid Cooling Module Incorporating Metal Foam and ..:

, In: 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm),
Lee, Jooyoung ; Ki, Seokkan ; Nam, Youngsuk - p. 559-565 , 2019
Link: https://doi.org/10.1109/ITHERM.2019.8757443