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1 Ergebnisse
1
Optimal Filler Sizes for Thermal Interface Materials:
, In:
2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
,
Chowdhury, Piyas
;
Sikka, Kamal
;
Grill, Alfred
. - p. 52-57 , 2019
Link:
https://doi.org/10.1109/ITHERM.2019.8757459
RT T1
2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
: T1
Optimal Filler Sizes for Thermal Interface Materials
UL https://suche.suub.uni-bremen.de/peid=ieee-8757459&Exemplar=1&LAN=DE A1 Chowdhury, Piyas A1 Sikka, Kamal A1 Grill, Alfred A1 Parekh, Dishit P. YR 2019 SN 2577-0799 K1 Computer aided software engineering K1 Heating systems K1 Thermal conductivity K1 Conductivity K1 Viscosity K1 Thermal resistance K1 Force K1 Packing Algorithm K1 Thermal Conductivity K1 Elastic Modulus K1 Filler Size Distributions SP 52 OP 57 LK http://dx.doi.org/https://doi.org/10.1109/ITHERM.2019.8757459 DO https://doi.org/10.1109/ITHERM.2019.8757459 SF ELIB - SuUB Bremen
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