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1 Ergebnisse
1
Comparison of Silicon Carbide Packages with Different Solde..:
, In:
2019 IEEE International Workshop on Integrated Power Packaging (IWIPP)
,
Kegley, Lauren E.
;
Foster, Tim
;
Seal, Sayan
... - p. 83-88 , 2019
Link:
https://doi.org/10.1109/IWIPP.2019.8799100
RT T1 <cTitle>2019 IEEE International Workshop on Integrated Power Packaging (IWIPP)</cTitle>: T1 <Title>Comparison of Silicon Carbide Packages with Different Solder Attach Materials under High Temperature, Fast Power Cycling Conditions</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-8799100&Exemplar=1&LAN=DE A1 Kegley, Lauren E. A1 Foster, Tim A1 Seal, Sayan A1 Shaw, Robert A1 McPherson, Brice A1 Passmore, Brandon A1 Schupbach, Marcelo A1 McNutt, Ty YR 2019 K1 Silicon carbide K1 Packaging K1 Silicon K1 Reliability K1 Failure analysis K1 Stress K1 Insulated gate bipolar transistors K1 Power Modules K1 Power Cycling K1 Reliability Modeling K1 Failure Mechanisms K1 Silicon Carbide SP 83 OP 88 LK http://dx.doi.org/https://doi.org/10.1109/IWIPP.2019.8799100 DO https://doi.org/10.1109/IWIPP.2019.8799100 SF ELIB - SuUB Bremen
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