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1 Ergebnisse
1
Novel Fine-Grain Back-Bias Assist Techniques for 14nm FDSOI..:
, In:
2019 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA)
,
Bosch, D.
;
Andrieu, F.
;
Ciampolini, L.
... - p. 1-2 , 2019
Link:
https://doi.org/10.1109/VLSI-TSA.2019.8804649
RT T1
2019 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA)
: T1
Novel Fine-Grain Back-Bias Assist Techniques for 14nm FDSOI Top-Tier SRAMs integrated in 3D-Monolithic
UL https://suche.suub.uni-bremen.de/peid=ieee-8804649&Exemplar=1&LAN=DE A1 Bosch, D. A1 Andrieu, F. A1 Ciampolini, L. A1 Makosiej, A. A1 Weber, O. A1 Garros, X. A1 Lacord, J. A1 Cluzel, J. A1 Esmanhotto, E. A1 Rios, M. A1 Lang, S. A1 Giraud, B. A1 Berthelon, R. A1 Cibrario, G. A1 Brunet, L. A1 Batude, P. A1 Fenouillet-Beranger, C. A1 Lattard, D. A1 Colinge, J. P. A1 Balestra, F. A1 Vinet, M. YR 2019 K1 Random access memory K1 Silicon-on-insulator K1 SPICE K1 Capacitance K1 Metals K1 Three-dimensional displays K1 Logic gates SP 1 OP 2 LK http://dx.doi.org/https://doi.org/10.1109/VLSI-TSA.2019.8804649 DO https://doi.org/10.1109/VLSI-TSA.2019.8804649 SF ELIB - SuUB Bremen
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