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1 Ergebnisse
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Impact of BEOL Design on Self-heating and Reliability in Hi..:
, In:
2019 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)
,
Choi, Jaehee
;
Monga, Udit
;
Park, Yonghee
... - p. 1-4 , 2019
Link:
https://doi.org/10.1109/SISPAD.2019.8870479
RT T1
2019 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)
: T1
Impact of BEOL Design on Self-heating and Reliability in Highly-scaled FinFETs
UL https://suche.suub.uni-bremen.de/peid=ieee-8870479&Exemplar=1&LAN=DE A1 Choi, Jaehee A1 Monga, Udit A1 Park, Yonghee A1 Shim, Hyewon A1 Kwon, Uihui A1 Pae, Sangwoo A1 Kim, Dae Sin YR 2019 SN 1946-1577 K1 Metals K1 Heating systems K1 Reliability K1 FinFETs K1 Thermal conductivity K1 Thermal resistance K1 Human computer interaction K1 Impact of BEOL design K1 Self-heating effect K1 Aging K1 HCI K1 BTI K1 EM K1 FinFET SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/SISPAD.2019.8870479 DO https://doi.org/10.1109/SISPAD.2019.8870479 SF ELIB - SuUB Bremen
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