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1 Ergebnisse
1
Process Development of Low Resistive Ag-Based Through Silic..:
, In:
2019 IEEE 32nd International Conference on Micro Electro Mechanical Systems (MEMS)
,
Yang, Jia-Han
;
Tsou, Kun-Lin
;
Fu, Yu-Min
.. - p. 376-379 , 2019
Link:
https://doi.org/10.1109/MEMSYS.2019.8870649
RT T1
2019 IEEE 32nd International Conference on Micro Electro Mechanical Systems (MEMS)
: T1
Process Development of Low Resistive Ag-Based Through Silicon Vias using Inkjet Printing Technique for 3D Microsystem Integration
UL https://suche.suub.uni-bremen.de/peid=ieee-8870649&Exemplar=1&LAN=DE A1 Yang, Jia-Han A1 Tsou, Kun-Lin A1 Fu, Yu-Min A1 Cheng, Yu-Ting A1 Song, Yen-Fang YR 2019 SN 2160-1968 K1 Through-silicon vias K1 Filling K1 Silicon K1 Ink jet printing K1 Substrates K1 Fabrication SP 376 OP 379 LK http://dx.doi.org/https://doi.org/10.1109/MEMSYS.2019.8870649 DO https://doi.org/10.1109/MEMSYS.2019.8870649 SF ELIB - SuUB Bremen
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