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Flip-Chip Integration of Inductive CMOS Tactile Sensor with..:

, In: 2019 IEEE 32nd International Conference on Micro Electro Mechanical Systems (MEMS),
Yeh, Sheng-Kai ; Fang, Weileun - p. 833-836 , 2019
Link: https://doi.org/10.1109/MEMSYS.2019.8870706