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1 Ergebnisse
1
Gen-Z Chipsetfor Exascale Fabrics:
, In:
2019 IEEE Hot Chips 31 Symposium (HCS)
,
Knebel, Patrick
;
Berkram, Dan
;
Davis, Al
... - p. 1-22 , 2019
Link:
https://doi.org/10.1109/HOTCHIPS.2019.8875646
RT T1 <cTitle>2019 IEEE Hot Chips 31 Symposium (HCS)</cTitle>: T1 <Title>Gen-Z Chipsetfor Exascale Fabrics</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-8875646&Exemplar=1&LAN=DE A1 Knebel, Patrick A1 Berkram, Dan A1 Davis, Al A1 Emmot, Darel A1 Faraboschi, Paolo A1 Gostin, Gary YR 2019 SN 2573-2048 K1 Analytical models K1 Data models K1 Computational modeling K1 Fabrics K1 Load modeling K1 Silicon K1 Big Data SP 1 OP 22 LK http://dx.doi.org/https://doi.org/10.1109/HOTCHIPS.2019.8875646 DO https://doi.org/10.1109/HOTCHIPS.2019.8875646 SF ELIB - SuUB Bremen
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