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Composition of Metal Layers in CMOS-MEMS Micromachining Pro..:
, In:
2019 16th International Conference on Electrical Engineering, Computing Science and Automatic Control (CCE)
,
Granados-Rojas, Benito
;
Reyes-Barranca, Mario Alfredo
;
Flores-Nava, Luis Martin
... - p. 1-4 , 2019
Link:
https://doi.org/10.1109/ICEEE.2019.8884506
RT T1
2019 16th International Conference on Electrical Engineering, Computing Science and Automatic Control (CCE)
: T1
Composition of Metal Layers in CMOS-MEMS Micromachining Process
UL https://suche.suub.uni-bremen.de/peid=ieee-8884506&Exemplar=1&LAN=DE A1 Granados-Rojas, Benito A1 Reyes-Barranca, Mario Alfredo A1 Flores-Nava, Luis Martin A1 Stephany Abarca-Jimenez, Griselda A1 Aleman-Arce, Miguel Angel A1 Gonzalez-Navarro, Yesenia Eleonor YR 2019 SN 2642-3766 K1 Microsensors K1 Micromechanical devices K1 Silicon compounds K1 Microactuators K1 Titanium nitride K1 CMOS integrated circuits K1 Etching K1 Micromachining K1 CMOS-MEMS K1 MEMS K1 Inertial K1 Sensor K1 TiN K1 Aluminum K1 Silicon dioxide SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/ICEEE.2019.8884506 DO https://doi.org/10.1109/ICEEE.2019.8884506 SF ELIB - SuUB Bremen
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