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1
Analysis of PCB return path configuration effect on Transie..:
, In:
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC)
,
Lin, Han-Nien
;
Huang, Jia-Yu
;
Huang, Yu-Chun
... - p. 214-217 , 2019
Link:
https://doi.org/10.23919/EMCTokyo.2019.8893836
RT T1 <cTitle>2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC)</cTitle>: T1 <Title>Analysis of PCB return path configuration effect on Transient ESD Suppression</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-8893836&Exemplar=1&LAN=DE A1 Lin, Han-Nien A1 Huang, Jia-Yu A1 Huang, Yu-Chun A1 Lin, Min-Shang A1 Ho, Tzu-Hao A1 Su, Chia-Hung YR 2019 K1 Electrostatic discharges K1 Transient analysis K1 TV K1 Current distribution K1 Analytical models K1 Integrated circuit modeling K1 ESD K1 IC K1 PCB K1 Ground plane configuration SP 214 OP 217 LK http://dx.doi.org/https://doi.org/10.23919/EMCTokyo.2019.8893836 DO https://doi.org/10.23919/EMCTokyo.2019.8893836 SF ELIB - SuUB Bremen
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