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1
Study on Temperature Impact of the Dielectric Material Loss..:
, In:
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC)
,
Kuo, Hung-Chun
;
Jhong, Ming-Fong
;
Wang, Chen-Chao
- p. 289-292 , 2019
Link:
https://doi.org/10.23919/EMCTokyo.2019.8893852
RT T1 <cTitle>2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC)</cTitle>: T1 <Title>Study on Temperature Impact of the Dielectric Material Loss for AiP Application</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-8893852&Exemplar=1&LAN=DE A1 Kuo, Hung-Chun A1 Jhong, Ming-Fong A1 Wang, Chen-Chao YR 2019 K1 Temperature measurement K1 Transmission line measurements K1 Dielectric losses K1 Dielectric loss measurement K1 Propagation losses K1 Conductors K1 transmission line K1 package K1 temperature K1 millimeter wave K1 antenna-in-package K1 AiP K1 Df extraction SP 289 OP 292 LK http://dx.doi.org/https://doi.org/10.23919/EMCTokyo.2019.8893852 DO https://doi.org/10.23919/EMCTokyo.2019.8893852 SF ELIB - SuUB Bremen
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