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1 Ergebnisse
1
Root Cause Analysis and Defect Ground Effect of EMI Problem..:
, In:
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC)
,
Lin, Han-Nien
;
Tseng, Wei-Ding
;
Wu, Cheng-Hau
.. - p. 440-443 , 2019
Link:
https://doi.org/10.23919/EMCTokyo.2019.8893873
RT T1 <cTitle>2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC)</cTitle>: T1 <Title>Root Cause Analysis and Defect Ground Effect of EMI Problem for Power Electronics</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-8893873&Exemplar=1&LAN=DE A1 Lin, Han-Nien A1 Tseng, Wei-Ding A1 Wu, Cheng-Hau A1 Yeh, Ting-Hao A1 Ho, Tzu-Hao YR 2019 K1 Electromagnetic interference K1 Integrated circuit modeling K1 Capacitors K1 DC-DC power converters K1 Universal Serial Bus K1 DC Converter K1 EMI regulation K1 PCB Design SP 440 OP 443 LK http://dx.doi.org/https://doi.org/10.23919/EMCTokyo.2019.8893873 DO https://doi.org/10.23919/EMCTokyo.2019.8893873 SF ELIB - SuUB Bremen
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