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1 Ergebnisse
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Design and Analysis of Flexible Interconnects on an Extreme..:
, In:
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC)
,
Jeong, Seungtaek
;
Kim, Subin
;
Kim, Youngwoo
... - p. 387-390 , 2019
Link:
https://doi.org/10.23919/EMCTokyo.2019.8893905
RT T1 <cTitle>2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC)</cTitle>: T1 <Title>Design and Analysis of Flexible Interconnects on an Extremely Thin Silicon Substate for Flexible Wearable Devices</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-8893905&Exemplar=1&LAN=DE A1 Jeong, Seungtaek A1 Kim, Subin A1 Kim, Youngwoo A1 Park, Shinyoung A1 Park, Hyunwook A1 Kim, Joungho A1 Lee, Jae Hak A1 Song, Jun Yeob YR 2019 K1 Semiconductor device measurement K1 Silicon K1 Integrated circuit interconnections K1 Substrates K1 Polymers K1 Loss measurement K1 Stress K1 flexible chip K1 flexible interconnects K1 flexible PCB K1 signal integrity K1 S-parameter K1 thin silicon substrate SP 387 OP 390 LK http://dx.doi.org/https://doi.org/10.23919/EMCTokyo.2019.8893905 DO https://doi.org/10.23919/EMCTokyo.2019.8893905 SF ELIB - SuUB Bremen
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