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1 Ergebnisse
1
Study of Thick Copper Metallization with WNx as Diffusion B..:
, In:
2019 14th European Microwave Integrated Circuits Conference (EuMIC)
,
Lin, Y. C.
;
Lee, M. W.
;
Tsai, M. Y.
... - p. 68-71 , 2019
Link:
https://doi.org/10.23919/EuMIC.2019.8909414
RT T1
2019 14th European Microwave Integrated Circuits Conference (EuMIC)
: T1
Study of Thick Copper Metallization with WNx as Diffusion Barrier for AlGaN/GaN HEMTs
UL https://suche.suub.uni-bremen.de/peid=ieee-8909414&Exemplar=1&LAN=DE A1 Lin, Y. C. A1 Lee, M. W. A1 Tsai, M. Y. A1 Wang, C. A1 Yao, J. N. A1 Huang, T. J. A1 Hsu, H. T. A1 Maa, J. S. A1 Chang, Edward Y. YR 2019 K1 Copper K1 Metallization K1 HEMTs K1 MODFETs K1 Aluminum gallium nitride K1 Wide band gap semiconductors K1 copper metallization K1 AlGaN/GaN HEMT K1 low noise figure K1 thermal stability K1 interconnect metal SP 68 OP 71 LK http://dx.doi.org/https://doi.org/10.23919/EuMIC.2019.8909414 DO https://doi.org/10.23919/EuMIC.2019.8909414 SF ELIB - SuUB Bremen
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