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1 Ergebnisse
1
Industrial 650V 4-Pack Super-Junction MOSFET Module using T..:
, In:
2019 IEEE Energy Conversion Congress and Exposition (ECCE)
,
Lim, Jangmuk
;
Seong, Jihwan
;
Yoon, Sang Won
... - p. 4097-4101 , 2019
Link:
https://doi.org/10.1109/ECCE.2019.8912910
RT T1 <cTitle>2019 IEEE Energy Conversion Congress and Exposition (ECCE)</cTitle>: T1 <Title>Industrial 650V 4-Pack Super-Junction MOSFET Module using Transfer Molding Process</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-8912910&Exemplar=1&LAN=DE A1 Lim, Jangmuk A1 Seong, Jihwan A1 Yoon, Sang Won A1 Suk Kim, You A1 Im, Hun-Chang A1 Hong, Won Sik YR 2019 SN 2329-3748 K1 Multichip modules K1 MOSFET K1 Thermal resistance K1 Inductance K1 Transfer molding K1 Electrical resistance measurement K1 4-Pack Power Module K1 Super-Junction MOSFET K1 Transfer Molding K1 Package on-resistance K1 Stray Inductance K1 Junction to Case Thermal Resistance SP 4097 OP 4101 LK http://dx.doi.org/https://doi.org/10.1109/ECCE.2019.8912910 DO https://doi.org/10.1109/ECCE.2019.8912910 SF ELIB - SuUB Bremen
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