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1 Ergebnisse
1
Chip to Wafer Hybrid Bonding with Cu Interconnect: High Vol..:
, In:
2019 International Wafer Level Packaging Conference (IWLPC)
,
Gao, Guilian
;
Mrozek, Pawel
;
Workman, Thomas
... - p. 1-9 , 2019
Link:
https://doi.org/10.23919/IWLPC.2019.8913877
RT T1
2019 International Wafer Level Packaging Conference (IWLPC)
: T1
Chip to Wafer Hybrid Bonding with Cu Interconnect: High Volume Manufacturing Process Compatibility Study
UL https://suche.suub.uni-bremen.de/peid=ieee-8913877&Exemplar=1&LAN=DE A1 Gao, Guilian A1 Mrozek, Pawel A1 Workman, Thomas A1 Mirkarimi, Laura A1 Fountain, Gill A1 Theil, Jeremy A1 Guevara, Gabe A1 Uzoh, Cyprian A1 Lee, Bongsub A1 Liu, Ping YR 2019 K1 Bonding K1 Annealing K1 Surface treatment K1 Dielectrics K1 Ovens K1 Throughput K1 Flip-chip devices K1 Cu-to-Cu bonding K1 hybrid bonding K1 DBI® Ultra K1 D2W K1 D2D K1 chip to wafer K1 die stacking K1 3D K1 2.5D SP 1 OP 9 LK http://dx.doi.org/https://doi.org/10.23919/IWLPC.2019.8913877 DO https://doi.org/10.23919/IWLPC.2019.8913877 SF ELIB - SuUB Bremen
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