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1
Thermomechanical Characterization of Polymer Thin Films. Ap..:
, In:
2019 International Wafer Level Packaging Conference (IWLPC)
,
Vignoud, Lionel
;
Assigbe, Nicolas
;
Morin, Christine
... - p. 1-8 , 2019
Link:
https://doi.org/10.23919/IWLPC.2019.8914090
RT T1 <cTitle>2019 International Wafer Level Packaging Conference (IWLPC)</cTitle>: T1 <Title>Thermomechanical Characterization of Polymer Thin Films. Application for the Conception and the Manufacturing of a 3D Interposer</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-8914090&Exemplar=1&LAN=DE A1 Vignoud, Lionel A1 Assigbe, Nicolas A1 Morin, Christine A1 Dechamp, Jerome A1 Roulet, Lucile A1 Parry, Guillaume A1 Estevez, Rafael YR 2019 K1 Polymers K1 Strain K1 Stress K1 Temperature measurement K1 Substrates K1 Temperature K1 Films K1 Polymer K1 Thermomecanical properties K1 Thin film layer K1 Coefficient of Thermal Expansion K1 analytical simulation SP 1 OP 8 LK http://dx.doi.org/https://doi.org/10.23919/IWLPC.2019.8914090 DO https://doi.org/10.23919/IWLPC.2019.8914090 SF ELIB - SuUB Bremen
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