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Novel Temporary Bonding and Debonding Solutions Enabling an..:

, In: 2019 International Wafer Level Packaging Conference (IWLPC),

Podpod, Arnita ; Miller, Andy ; Beyer, Gerald... - p. 1-6 , 2019

Link: https://doi.org/10.23919/IWLPC.2019.8914144

RT 
T1 <cTitle>2019 International Wafer Level Packaging Conference (IWLPC)</cTitle>: T1 <Title>Novel Temporary Bonding and Debonding Solutions Enabling an Ultrahigh Interonnect Density Fo-Wlp Structure Assembly with Quasi-Zero Die Shift</Title>

UL https://suche.suub.uni-bremen.de/peid=ieee-8914144&Exemplar=1&LAN=DE
				
A1 Podpod, Arnita
A1 Miller, Andy
A1 Beyer, Gerald
A1 Beyne, Eric
A1 Guerrero, Alice
A1 Liu, Xiao
A1 Wu, Qi
A1 Yess, Kim
A1 Arnold, Kim
A1 Phommahaxay, Alain
A1 Bex, Pieter
A1 Kennes, Koen
A1 Bertheau, Julien
A1 Arumugam, Hariharan
A1 Cochet, Tom
A1 Rebibis, Kenneth
A1 Sleeckx, Erick
YR 2019
K1 Substrates
K1 Silicon
K1 Bonding
K1 Liquids
K1 Wafer scale integration
K1 Temperature measurement
K1 Flip-chip devices
K1 Wafer bonding
K1 Wafer thinning
K1 Temporary bonding material
K1 adhesive
K1 Die attach
K1 Fan-out
K1 Carrier debonding
K1 Fan-Out Wafer-Level Package
K1 Heterogenous Integration
K1 Flip-Chip
K1 Warpage
K1 Die shift
SP 1
OP 6
LK http://dx.doi.org/https://doi.org/10.23919/IWLPC.2019.8914144
DO https://doi.org/10.23919/IWLPC.2019.8914144
SF ELIB - SuUB Bremen

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