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1 Ergebnisse
1
Novel Temporary Bonding and Debonding Solutions Enabling an..:
, In:
2019 International Wafer Level Packaging Conference (IWLPC)
,
Podpod, Arnita
;
Miller, Andy
;
Beyer, Gerald
... - p. 1-6 , 2019
Link:
https://doi.org/10.23919/IWLPC.2019.8914144
RT T1
2019 International Wafer Level Packaging Conference (IWLPC)
: T1
Novel Temporary Bonding and Debonding Solutions Enabling an Ultrahigh Interonnect Density Fo-Wlp Structure Assembly with Quasi-Zero Die Shift
UL https://suche.suub.uni-bremen.de/peid=ieee-8914144&Exemplar=1&LAN=DE A1 Podpod, Arnita A1 Miller, Andy A1 Beyer, Gerald A1 Beyne, Eric A1 Guerrero, Alice A1 Liu, Xiao A1 Wu, Qi A1 Yess, Kim A1 Arnold, Kim A1 Phommahaxay, Alain A1 Bex, Pieter A1 Kennes, Koen A1 Bertheau, Julien A1 Arumugam, Hariharan A1 Cochet, Tom A1 Rebibis, Kenneth A1 Sleeckx, Erick YR 2019 K1 Substrates K1 Silicon K1 Bonding K1 Liquids K1 Wafer scale integration K1 Temperature measurement K1 Flip-chip devices K1 Wafer bonding K1 Wafer thinning K1 Temporary bonding material K1 adhesive K1 Die attach K1 Fan-out K1 Carrier debonding K1 Fan-Out Wafer-Level Package K1 Heterogenous Integration K1 Flip-Chip K1 Warpage K1 Die shift SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.23919/IWLPC.2019.8914144 DO https://doi.org/10.23919/IWLPC.2019.8914144 SF ELIB - SuUB Bremen
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