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1 Ergebnisse
1
Validating Die Crack Inspection with Topography Based Image..:
, In:
2019 International Wafer Level Packaging Conference (IWLPC)
,
Han, Woo Young
;
Marshall, Mike
;
Selby, Bryan
. - p. 1-5 , 2019
Link:
https://doi.org/10.23919/IWLPC.2019.8914148
RT T1 <cTitle>2019 International Wafer Level Packaging Conference (IWLPC)</cTitle>: T1 <Title>Validating Die Crack Inspection with Topography Based Image Sensor</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-8914148&Exemplar=1&LAN=DE A1 Han, Woo Young A1 Marshall, Mike A1 Selby, Bryan A1 Shay, Amy YR 2019 K1 Packaging K1 Sawing K1 Blades K1 Inspection K1 Surface cracks K1 Surfaces K1 Wafer scale integration K1 Advanced packaging K1 inspection K1 inner crack K1 side wall crack K1 WLP K1 FOWLP SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.23919/IWLPC.2019.8914148 DO https://doi.org/10.23919/IWLPC.2019.8914148 SF ELIB - SuUB Bremen
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