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1 Ergebnisse
1
Effects of the On-Die Decoupling Capacitors on the EME Perf..:
, In:
2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)
,
Rotigni, Mario
;
Merlo, Mauro
;
Sanna, Aurora
... - p. 78-80 , 2019
Link:
https://doi.org/10.1109/EMCCompo.2019.8919707
RT T1 <cTitle>2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)</cTitle>: T1 <Title>Effects of the On-Die Decoupling Capacitors on the EME Performance in 28 nm FD-SOI Technology</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-8919707&Exemplar=1&LAN=DE A1 Rotigni, Mario A1 Merlo, Mauro A1 Sanna, Aurora A1 Colombo, Paolo A1 Castellan, Renato A1 Liberali, Valentino A1 Barletta, Andrea A1 DeChecchi, Roberto A1 Skytte, Kristoffer Sander YR 2019 SN 2575-6893 K1 Clocks K1 Load flow K1 Integrated circuit modeling K1 Electromagnetic compatibility K1 Bonding K1 Wires K1 Capacitance K1 conducted emissions K1 150Ω measurement method K1 IR-drop analysis K1 automotive microcontrollers K1 EMI simulation K1 IEC 61967-4 K1 package K1 bonding wires SP 78 OP 80 LK http://dx.doi.org/https://doi.org/10.1109/EMCCompo.2019.8919707 DO https://doi.org/10.1109/EMCCompo.2019.8919707 SF ELIB - SuUB Bremen
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