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Analytical Modeling of Through-PCB Thermal Vias and Heat-Si..:

, In: 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC),
Catalano, Antonio Pio ; Trani, Roberto ; Castellazzi, Alberto. - p. 1-6 , 2019
Link: https://doi.org/10.1109/THERMINIC.2019.8923386