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Latest advancements towards delamination detection in a FCO..:
, In:
2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
,
Kumar, Akhil
;
Schulz, Marcus
;
Bader, Volker
... - p. 1-7 , 2019
Link:
https://doi.org/10.1109/THERMINIC.2019.8923388
RT T1 <cTitle>2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)</cTitle>: T1 <Title>Latest advancements towards delamination detection in a FCOB assembly using Thermal Pixel (Thixel) array</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-8923388&Exemplar=1&LAN=DE A1 Kumar, Akhil A1 Schulz, Marcus A1 Bader, Volker A1 Wohrmann, Markus A1 Bauer, Jorg A1 May, Daniel A1 Puri, Aakash A1 Ras, Mohamad Abo A1 Wunderle, Bernhard YR 2019 SN 2474-1523 K1 Delamination K1 Voltage measurement K1 Flip-chip devices K1 Semiconductor device measurement K1 Signal to noise ratio K1 Frequency measurement K1 Conferences SP 1 OP 7 LK http://dx.doi.org/https://doi.org/10.1109/THERMINIC.2019.8923388 DO https://doi.org/10.1109/THERMINIC.2019.8923388 SF ELIB - SuUB Bremen
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