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1
Temperature Rise Prediction of Conductor and Enclosure in a..:
, In:
2019 5th International Conference on Electric Power Equipment - Switching Technology (ICEPE-ST)
,
Ko, Jeong Ahn
;
Lee, Seungbo
;
Ryu, Gwang Hyeon
. - p. 42-45 , 2019
Link:
https://doi.org/10.1109/ICEPE-ST.2019.8928763
RT T1
2019 5th International Conference on Electric Power Equipment - Switching Technology (ICEPE-ST)
: T1
Temperature Rise Prediction of Conductor and Enclosure in a GIS Component Considering Contact Resistance
UL https://suche.suub.uni-bremen.de/peid=ieee-8928763&Exemplar=1&LAN=DE A1 Ko, Jeong Ahn A1 Lee, Seungbo A1 Ryu, Gwang Hyeon A1 Boong Jeong, Seung YR 2019 SN 2643-9816 K1 Temperature measurement K1 Conductors K1 Mathematical model K1 Temperature distribution K1 Solid modeling K1 Loss measurement K1 Current measurement SP 42 OP 45 LK http://dx.doi.org/https://doi.org/10.1109/ICEPE-ST.2019.8928763 DO https://doi.org/10.1109/ICEPE-ST.2019.8928763 SF ELIB - SuUB Bremen
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